IC Test/Burn-in & RF sockets
for QFP, TSSOP, CSP, BGA, QFN and MLFFeatures:
- Flexible, patented two-part spring contact system
- For ICs with grid dimensions from 0.2mm
- Five standard sizes for ICs up to 55mm
- IC sockets individually adapted to the application - from one piece onwards
- Replaceable spring contact units
- Gold spring contacts for applications up to 45GHz, thermoplastic elastomer contacts for systems above 45GHz
- Standard delivery time of 5 weeks for application-specific elaborated socket
Documents