High temperature sockets 200 - 300°C

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for DIP, PGA, CSP, BGA, LGA, QFN, MLCC and more

Features:

• For Burn-In and Test applications
• Different grid dimensions, pin count and footprints in standard 8 x 8 and 21 x 21 arrangements
• High frequency bandwidth (-1dB @>40GHz), low inductance (0.02nH) and high current (4A @14°C) applications
• Allows reliable ATE testing and burn-in

Manufacturer: Aries

Documents

• Datasheets