HDAF series

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• 2.00 x 1.20mm pitch
• Up to 299 I/Os
• Performance up to 9 GHz / 18 Gbps
• Application specific capability to build any height from 20 to 35mm
• Open pin field design
• Integrated guide posts to minimize contact damage when mating and unmating
• Solder charge termination for ease of processing
• Performance: Up to 9 GHz / 18 Gbps
• Intermateable with Molex HD Mezz Arrays
• HD Mezz is a trademark of Molex® Incorporated
• Dual sourced by Molex®

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