LPAM series

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LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Features:

• 1.27mm (0.050") pitch
• Low profile 4, 4.5 and 5mm stack heights
• Up to 400 I/Os
• 4, 6 and 8 row designs
• Dual beam contact system
• Solder crimp termination for ease of processing
• 56 Gbps PAM4 performance

Manufacturer: Samtec

Documents

• Catalogue pages