SUPERNOVA™
High-speed low profile one-piece compression arrays with body height as low as 1.27mm and dual or single compression contacts.
Features:
- 1.00mm (0.039") pitch
- 100 ¿ 300 total pins
- 1.27mm standard body height
- Dual compression or single compression with solder balls
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues
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