High-Speed I/O systems
High-speed low skew pair copper I/O assemblies with rugged latching systems and shielded EMI protection for rugged, panel-to-panel applications. Assemblies include HyperTransport™ HT 3.1 performance on the industry¿s densest I/O system, micro pitch design for board space savings, and SFP+ jumpers up to 20 Gbps data transmission.