XCEDE® HD


Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system¿s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.

Features:
  • Up to 84 differential pairs per linear inch
  • 1.80mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Up to a 3mm contact wipe on signal pins
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side wall options available
  • 85 and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
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