SI-FLY™
The extremely low 3.8mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates.
Features:
- Up to 16 pairs in an incredibly low 3.4mm profile
- Minimum 8.4mm height required for mating
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