CPC series

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Si-Fly™ Low-Profile, High-Density cable system

Features:

• Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
• Direct attach to IC Package
• Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
• 112 Gbps PAM4 per lane
• 5x the reach of traditional PCB solutions
• Eludes the BGA and routes signals directly from the silicon package through a long-reach cable

Manufacturer: Samtec

Documents

• Catalog pages